Experimental study of heat transfer in a microchannel with pin fins and sintered coatings

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dc.authorscopusid36627863400
dc.authorscopusid57222714210
dc.authorscopusid7006403293
dc.authorscopusid7801574348
dc.contributor.authorBulut, Murat
dc.contributor.authorShukla, M.
dc.contributor.authorKandlikar, S.G.
dc.contributor.authorSözbir, N.
dc.date.accessioned2023-07-26T11:54:41Z
dc.date.available2023-07-26T11:54:41Z
dc.date.issued2023
dc.departmentDÜ, Eğitim Fakültesi, Özel Eğitim Bölümüen_US
dc.description.abstractIncreasing processing capacity without modifying the size of electronic devices has made thermal management important in the electronic industry. Commercialized thermal management, such as in a conventional air cooling system, is insufficient for electronic devices with high heat flux dissipation. Pool boiling is a better method for heat transfer because it can dissipate a substantial amount of heat at low wall superheats. This study focused on heat transfer enhancement using passive approaches, including nanostructures and microporous sintered surfaces over open microchannel surfaces and microchannels with pin-fins. In the present work, seven structures were studied in pool boiling, wherein experiments elucidated the effects of microchannels, sintered, and pin fins (micropillar) on boiling heat transfer from a copper chip in a pool of degassed water. Boiling performance is ascertained via critical heat flux (CHF) and heat transfer coefficient (HTC). The best heat transfer performance showed a heat flux of 243.75W/cm2 at 15.46°C on the pin-fins chip, which was 1.9 times the heat flux of the plain chip. The highest HTC was 181.03 kW/(m2 oC) at a heat flux of 172.61 W/cm2 for the microchannel with single pin-fins. The HTC enhancement was 2.8 times greater than the plain surface. It was found experimentally that HTC and CHF improved on all modified surfaces compared to the plain copper chip baseline. © 2023 Taylor & Francis.en_US
dc.description.sponsorshipTürkiye Bilimsel ve Teknolojik Araştırma Kurumu, TÜBİTAKen_US
dc.description.sponsorshipMurat BULUT extends many thanks to the Scientific and Research Council of Turkey (TUBITAK) for TUBITAK-BIDEB 2214/A International Research Fellowship Program grant. The study took place in the Thermal Analysis, Microfluidics and Fuel Cell Laboratory in the Mechanical Engineering Department at Rochester Institute of Technology, Rochester, NY, USA. The author thanks to Sheila Christopher for revising the whole manuscript.en_US
dc.identifier.doi10.1080/08916152.2023.2176566
dc.identifier.issn0891-6152
dc.identifier.scopus2-s2.0-85147770292en_US
dc.identifier.scopusqualityQ1en_US
dc.identifier.urihttps://doi.org/10.1080/08916152.2023.2176566
dc.identifier.urihttps://hdl.handle.net/20.500.12684/12896
dc.identifier.wosWOS:000932994100001en_US
dc.identifier.wosqualityQ2en_US
dc.indekslendigikaynakScopusen_US
dc.institutionauthorAkemoğlu, Yusuf
dc.language.isoenen_US
dc.publisherTaylor and Francis Ltd.en_US
dc.relation.ispartofExperimental Heat Transferen_US
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.snmz$2023V1Guncelleme$en_US
dc.subjectcritical heat fluxen_US
dc.subjectHeat transfer enhancementen_US
dc.subjectmicrochannelen_US
dc.subjectpin finsen_US
dc.subjectpool boilingen_US
dc.subjectsintered coatingsen_US
dc.subjectCoatingsen_US
dc.subjectCooling systemsen_US
dc.subjectCopperen_US
dc.subjectElectronic coolingen_US
dc.subjectFins (heat exchange)en_US
dc.subjectHeat transfer coefficientsen_US
dc.subjectMicrochannelsen_US
dc.subjectSinteringen_US
dc.subjectTemperature controlen_US
dc.subjectThermal management (electronics)en_US
dc.subjectThermoelectric equipmenten_US
dc.subjectAir cooling systemen_US
dc.subjectCopper chipsen_US
dc.subjectElectronic industriesen_US
dc.subjectElectronics devicesen_US
dc.subjectHeat transfer co-efficientsen_US
dc.subjectHeat Transfer enhancementen_US
dc.subjectPin-finsen_US
dc.subjectPool boilingen_US
dc.subjectProcessing capacitiesen_US
dc.subjectSintered coatingsen_US
dc.subjectHeat fluxen_US
dc.titleExperimental study of heat transfer in a microchannel with pin fins and sintered coatingsen_US
dc.typeArticleen_US

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