Resistance of mechanically densified and thermally post-treated pine sapwood to wood decay fungi

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dc.contributor.authorPelit, Hüseyin
dc.contributor.authorYalçın, Mesut
dc.date.accessioned2020-04-30T23:31:39Z
dc.date.available2020-04-30T23:31:39Z
dc.date.issued2017
dc.departmentDÜ, Teknoloji Fakültesi, Ağaç İşleri Endüstri Mühendisliği Bölümüen_US
dc.descriptionWOS: 000412574500011en_US
dc.description.abstractThis paper evaluated the density and biological resistance of pinewood samples modified with thermo-mechanical densification and thermal post-treatment. The samples were densified with 20 and 40% compression ratios at either 110 or 150 A degrees C. The thermal post-treatment was then applied to the pine samples at 185 and 212 A degrees C for 2 h. These samples were exposed to white-rot (Trametes versicolor) and brown-rot (Coniophora puteana) fungi for twelve weeks and the resulting mass loss was determined. In the densified samples, the effects of the compression ratio on T. versicolor-initiated mass loss and of the compression temperature on C. puteana-initiated mass loss were found to be significant. The mass loss was less in the samples compressed at 150 A degrees C with the 40% ratio, while the highest mass loss was observed in the undensified samples. In the thermally post-treated samples, the resistance to both decay fungi was significantly increased with the increase of the treatment temperature. The mass loss in the thermally post-treated samples at 212 A degrees C after T. versicolor and C. puteana fungi testing was reduced by 73 and 67%, respectively. However, the effect of the densification processes on decay resistance in the thermally post-treated samples was insignificant.en_US
dc.identifier.doi10.1007/s10086-017-1641-4en_US
dc.identifier.endpage522en_US
dc.identifier.issn1435-0211
dc.identifier.issn1611-4663
dc.identifier.issue5en_US
dc.identifier.scopusqualityQ1en_US
dc.identifier.startpage514en_US
dc.identifier.urihttps://doi.org/10.1007/s10086-017-1641-4
dc.identifier.urihttps://hdl.handle.net/20.500.12684/4388
dc.identifier.volume63en_US
dc.identifier.wosWOS:000412574500011en_US
dc.identifier.wosqualityQ1en_US
dc.indekslendigikaynakWeb of Scienceen_US
dc.indekslendigikaynakScopusen_US
dc.language.isoenen_US
dc.publisherSpringer Japan Kken_US
dc.relation.ispartofJournal Of Wood Scienceen_US
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/openAccessen_US
dc.subjectDensificationen_US
dc.subjectThermal post-treatmenten_US
dc.subjectPine wooden_US
dc.subjectBiological resistanceen_US
dc.titleResistance of mechanically densified and thermally post-treated pine sapwood to wood decay fungien_US
dc.typeArticleen_US

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