Determination of relationship between thermal and mechanical properties of wood material

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dc.contributor.authorÖzcan, Cemal
dc.contributor.authorKorkmaz, Mustafa
dc.date.accessioned2020-04-30T13:32:18Z
dc.date.available2020-04-30T13:32:18Z
dc.date.issued2019
dc.departmentDÜ, Orman Fakültesi, Orman Endüstrisi Mühendisliği Bölümüen_US
dc.description.abstractNon-destructive test techniques are becoming increasingly important for assessment and maintenance. These techniques are very useful for assessment of materials such as wood, whose performance can vary considerably depending on the conditions of use. It is possible to estimate some mechanical properties of a material by determining the movement of energy through the material with the help of these techniques. In this study, it was investigated whether the wood material could be tested nondestructively by the heat energy produced by a source. The correlations between the thermal conductivity and mechanical properties of Scots pine (Pinus sylvestris L.) and sessile oak (Quercus petraea L.) woods were investigated. The thermal conductivity (TC), density, modulus of rupture (MOR), compression strength (CS), and modulus of elasticity (MOE) values of samples were measured according to the related standards and these values were correlated with each other. The linear and multiple regression tests were employed to determine the correlation between thermal conductivity and mechanical properties. The results showed that there is a very strong correlation between thermal conductivity and both density and MOR values. However, the correlations between TC and both MOE and CS were moderate. The results of this study suggest that the thermal conductivity value can be used to estimate the density and some mechanical properties of wood. © 2019, Korean Society of Wood Science Technology. All rights reserved.en_US
dc.identifier.doi10.5658/WOOD.2019.47.4.408en_US
dc.identifier.endpage417en_US
dc.identifier.issn1017-0715
dc.identifier.issue4en_US
dc.identifier.scopusqualityN/Aen_US
dc.identifier.startpage408en_US
dc.identifier.urihttps://dx.doi.org/10.5658/WOOD.2019.47.4.408
dc.identifier.urihttps://hdl.handle.net/20.500.12684/217
dc.identifier.volume47en_US
dc.indekslendigikaynakScopusen_US
dc.language.isoenen_US
dc.publisherKorean Society of Wood Science Technologyen_US
dc.relation.ispartofJournal of the Korean Wood Science and Technologyen_US
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.subjectMechanical properties; Pine; Sessile oak; Thermal conductivityen_US
dc.titleDetermination of relationship between thermal and mechanical properties of wood materialen_US
dc.typeArticleen_US

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