Effects of Moisture and Direction of Grain on the Thermal Conductivity and Mechanical Properties of Black Alder and Scots Pine

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dc.contributor.authorKurt, Şeref
dc.contributor.authorKorkmaz, Mustafa
dc.date.accessioned2023-07-26T11:58:35Z
dc.date.available2023-07-26T11:58:35Z
dc.date.issued2022
dc.departmentDÜ, Orman Fakültesi, Orman Endüstrisi Mühendisliği Bölümüen_US
dc.description.abstractAim of study: Relationships between moisture content and thermal conductivity and mechanical properties of wood species were examined. Material and methods: Black Alder (Alnus glutinosa L.) and Scots Pine (Pinus sylvestris L.) specimens were used. Thermal conductivity, modulus of rupture, compression strength and impact bending strength values were determined and analyzed. All specimens were examined at 3 different moisture levels which are oven-dry, fiber saturation point (FSP) and completely wet. Main results: The lowest thermal conductivity value was found in the perpendicular to the grain direction of oven dried Black Alder samples as 0.119 W/mK. The highest thermal conductivity value was found in the parallel direction of Scots pine samples with FSP humidity content as 0.340 W/mK. In addition, the thermal conductivity value parallel to the grain is significantly higher than perpendicular one at all three moisture levels. Highlights: While there is a positive linear relationship between the moisture content of the wood and its dynamic bending resistance and thermal conductivity; It was found that there is a negative linear relationship between bending strength and compressive strength value.en_US
dc.description.sponsorshipTUBITAK, The Scientific and Technological Research Council of Turkey, scientific research project [114O644]en_US
dc.description.sponsorshipThis study was funded by TUBITAK, The Scientific and Technological Research Council of Turkey, scientific research project with the grant number 114O644.en_US
dc.identifier.doi10.17475/kastorman.1095741
dc.identifier.endpage39en_US
dc.identifier.issn1303-2399
dc.identifier.issn1303-4181
dc.identifier.issue1en_US
dc.identifier.startpage33en_US
dc.identifier.urihttps://doi.org/10.17475/kastorman.1095741
dc.identifier.urihttps://hdl.handle.net/20.500.12684/13523
dc.identifier.volume22en_US
dc.identifier.wosWOS:000784036000004en_US
dc.identifier.wosqualityN/Aen_US
dc.indekslendigikaynakWeb of Scienceen_US
dc.institutionauthorKorkmaz, Mustafa
dc.language.isoenen_US
dc.publisherKastamonu Univen_US
dc.relation.ispartofKastamonu University Journal of Forestry Facultyen_US
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/openAccessen_US
dc.snmz$2023V1Guncelleme$en_US
dc.subjectThermal Conductivity; Moisture Content; Grain Direction; Impact Bending Strengthen_US
dc.subjectDiffusivityen_US
dc.titleEffects of Moisture and Direction of Grain on the Thermal Conductivity and Mechanical Properties of Black Alder and Scots Pineen_US
dc.typeArticleen_US

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