INFLUENCE OF BONDLINE THICKNESS ON THE PERFORMANCE OF ADHESIVE JOINTS UNDER BALLISTIC PEEL IMPACT

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dc.contributor.authorDemir, Gizem Derya
dc.contributor.authorYildiz, Salih
dc.contributor.authorGursel, Ali
dc.contributor.authorIkikardaslar, Kerim Tuna
dc.contributor.authorDelale, Feridun
dc.date.accessioned2024-08-23T16:07:20Z
dc.date.available2024-08-23T16:07:20Z
dc.date.issued2023en_US
dc.departmentDüzce Üniversitesien_US
dc.descriptionASME International Mechanical Engineering Congress and Exposition (IMECE) -- OCT 29-NOV 02, 2023 -- New Orleans, LAen_US
dc.description.abstractAs structural adhesive technology advances, adhesive joints provide attractive advantages over conventional fastening methods. Since welding, riveting, and bolting may cause nonuniform stress distribution across the joint, and in many cases cannot be used to bond dissimilar materials such as composites to metals, adhesive joining may be considered as an alternative joining method. It is well known that the geometry of adhesive joints as well as their material properties and the adhesive thickness may affect their performance. In this study, an adhesive joint consisting of an aluminum back plate and a patch bonded by an epoxy is employed to investigate the influence of the bond thickness on the performance of adhesive joints under predominantly Mode I ballistic impact. A pressure gas gun is used for the dynamic test. High speed camera (Phantom V710) was used to record specimen behavior under ballistic peel impact tests. Frame rate of the high-speed camera to capture impacts was kept at 120,000 per second. The effect of bondline thicknesses (i.e., 0.005. (0.127 mm), 0.01. (0.254 mm), 0.015. (0.381 mm) on the adhesive joint performance were investigated. The results indicate that the adhesive joint with 0.01. mm bondline thickness performs better than those with 0.005. and 0.015. adhesive thickness. In addition to the experimental work, Finite Element Analysis is carried out to determine the mechanical properties of the joints by an inverse problem-solving technique.en_US
dc.description.sponsorshipAmer Soc Mech Engineersen_US
dc.identifier.isbn978-0-7918-8761-5en_US
dc.identifier.urihttps://hdl.handle.net/20.500.12684/14610
dc.identifier.wosWOS:001216797200064en_US
dc.identifier.wosqualityN/Aen_US
dc.indekslendigikaynakWeb of Scienceen_US
dc.language.isoenen_US
dc.publisherAmer Soc Mechanical Engineersen_US
dc.relation.ispartofProceedings of Asme 2023 International Mechanical Engineering Congress and Exposition, Imece2023, Vol 4en_US
dc.relation.publicationcategoryKonferans Öğesi - Uluslararası - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.subjectBallistic Impacten_US
dc.subjectStrain Rateen_US
dc.subjectAdhesive Jointen_US
dc.subjectStrain-Rateen_US
dc.subjectTemperatureen_US
dc.subjectBehavioren_US
dc.titleINFLUENCE OF BONDLINE THICKNESS ON THE PERFORMANCE OF ADHESIVE JOINTS UNDER BALLISTIC PEEL IMPACTen_US
dc.typeConference Objecten_US

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